ION Beam IC Tray 
Definition: Engineering plastic as transport container with semiconductor device 

Use: Semiconductor transport, protection for semiconductor drying process(130℃~180℃)   

Requirement of ION Beam IC Tray 
* Dimensional stability: There should be no contraction and alteration during drying process 
* Conductivity: Damage of semiconductor by generation of static electricity should be prevented 
* Impact reducing: Semiconductor should be protected from shock 
* Heat resistant : There should be no alteration when product is baked three times for 24 hours at 130℃~180℃ 
* Light Weight : Weight of product should be light for air transport 
* Environmental friendliness: Recycling for Tray should be possible 
* Non- harmful : There should be no harm to human body   

Material of ION Beam IC Tray 
●we developed materials added Glass Fiber to MPPO according to test in cooperation with LG Chemicals and prepared to manufacture materials 
●Considering the following characteristics of materials of MPPO, it is suitable for semiconductor tray 
- low density and low moisture absorption 
- Excellent resistant to hydrosis 
- Excellent chemical resistent to solvent agent

Optional Information
- Payment : T/T in Advance
- Payment Price : 2.3 USD
- Origin : Republic of Korea
- Minimum Order : 1,000 pcs
- Packaging : 100pcs/pack
- Samples : Charge
- Sample Price : 2 USD
- Remarks : payment price 2.3/pcs sample price 2.0/pcs